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  • The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and Vertical Vapor Chambers.



  • The first-ever CPU heatsink to use Vertical Vapor Chamber technology.
  • 100% pure polished copper base – combinedwith improved soldering technologies for the best thermal transfer.
  • Special fin design – heatsink receives concentrated cold airflow.
  • Improved air pressure design and fan mounting system.