ThermalFusion 400
RG-TF4-TGU1-GP

 
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Description

ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
  1. High Thermal Conductivity
  2. Low Thermal Resistance
  3. Non-Curing
  4. Non-Corrosive
  5. Easy Application with Included Razor Blade

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