TPC 812
RR-T812-24PK-R1; RR-T812-24PK-R2

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The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heat pipes and a specialized heatsink and fin design allow the TPC 812 to outperform the competition.
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1. The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
2. Ready for overclocking, benchmarking and silent cooling.
3. The first-ever CPU heatsink to use vertical vapor chamber technology.
4. 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
5. Special fin design – heatsink receives concentrated cold airflow.
6. Improved air pressure design and fan mounting system.




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