Details  |  Reviews  |  Support  |  Video  |  Available At                                   Email Page | Print Page | Comparison
With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
  • High thermal conductivity.
  • Low thermal resistance.
  • Non-corrosive.
  • Best thermal stability in high temperature.
  • Excellent adhesion.
  • Preserve in room temperature for longer lifespan.
  • Up to 500 applications


Model RG-ICFN-200G-B1
Specific Gravity >2.5 @ 25°C
Color White
Dielectric Constant >5.1 at 100Hz
Dissipation Factor <0.005 at 100Hz
Thermal Conductivity >1.22
Weight 200G
Other Up to 500 applications
UPC Code 884102007958
Disclaimer: Images are for informative purposes only; displayed parts and accessories may not be included in the actual product package.

Click a thumbnail below to view a larger image.

There are no reviews for this product


Name Type Release Date Description
IceFusion 200G Product Sheet 2010.01.29 Product sheet for IceFusion 200G thermal interface


There are no FAQ items for this product

More Information

There are no videos for this product.
Online Stores:
no location available

Distributors & Others:
no location available