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 Introduction
With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
 Features
  • High thermal conductivity.
  • Low thermal resistance.
  • Non-corrosive.
  • Best thermal stability in high temperature.
  • Excellent adhesion.
  • Preserve in room temperature for longer lifespan.
  • Up to 500 applications

 

 Specifications
Model RG-ICFN-200G-B1
Specific Gravity >2.5 @ 25°C
Color White
Dielectric Constant >5.1 at 100Hz
Dissipation Factor <0.005 at 100Hz
Thermal Conductivity >1.22
Weight 200G
Other Up to 500 applications
UPC Code 884102007958
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Name Type Release Date Description
IceFusion 200G Product Sheet 2010.01.29 Product sheet for IceFusion 200G thermal interface

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