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 Introduction

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. 

 Features
  • Suitable for CPU, chipsets on Mainboard, VGA card, etc. 
  • Easy to use.
  • Zif Socket Templates ensure correct applying area with various CPU socket types.
  • Produces an even layer when using applicator.
  • Dielectric.
  • Wide range of application temperature.

 

 Specifications
Model HTK-002
Color White
Specific Gravity 2.37
Viscosity/Flowability Nonflowing
Shelf Life 24 months from DOM
Thermal Conductivity 0.8 watts/meter- °C
Volume Resistivity 5.0 x 1015
Dielectric Constant 4.4 at 100k Hz
Dissipation Factor 0.02 at 100k Hz
Dielectric Strength 550 volts/mil; 21.7 kV/mm
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